Silicone Thermal Pad

Silicone Thermal Pad or called Silicone Based Gap Fillers are used to fill gaps of 0.1 – 10mm between surfaces and lower thermal resistance by excluding air from the interface, usually between heat-generating components (electronic components such as IC, CPU, MOS, LED) and heat sinks, heat spreaders or other cooling devices.
Our Silicone Thermal Pad and Silicone-Based Gap Filler  products have not only high thermal conductivity but also excellently compressive capacity of approx. 25% – 40% which helps to reduce pressure to electronic components

Liquid-Dispensed Silicone Thermal Pad / GapFiller SilCool* TIA268GF (XE14-C7413)

  • Product code: SilCool* TIA268GF (XE14-C7413)
  • Manufacturer: Momentive
  • Package size:
  • Shelf life:
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3M™ Thermally Conductive Silicone Interface Pad 5549S

  • Product code: 5549S
  • Manufacturer: 3M
  • Package size:
  • Shelf life:
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BERGQUIST® GAP PAD® TGP A2600

  • Product code: TGP A2600
  • Manufacturer: Henkel
  • Package size: 0.381 to 3.175mm
  • Shelf life: 6 month
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BERGQUIST® GAP PAD® TGP 2000 (GAP PAD® 2000S40)

  • Product code: 2000S40
  • Manufacturer: Henkel
  • Package size: 0.508 to 3.175mm
  • Shelf life: 6 tháng
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BERGQUIST® GAP PAD® TGP A2000

  • Product code: TGP A2000
  • Manufacturer: Henkel
  • Package size: 0.254 to 1.016mm
  • Shelf life: 6 month
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BERGQUIST® GAP PAD® TGP 1300

  • Product code: TGP 1300
  • Manufacturer: Henkel
  • Package size: 0.508 to 6.35mm
  • Shelf life: 6 month
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BERGQUIST® GAP PAD® TGP 1500R

  • Product code: TGP 1500R
  • Manufacturer: Henkel
  • Package size:
  • Shelf life: 6 month
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