Liquid-Dispensed Silicone Thermal Pad / Gap Filler SilCool TIA241GF

SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping pasty consistency offers physical stability that can allow improved processing. SilCool TIA241GF gap filler can be used as a liquid dispensed alternative to pre-fabricated thermal pads in a broad array of thermal designs for electronic applications.

Key Features

Good thermal conductivity
Fast, low temperature cure
Convenient 1:1 mix ratio by weight
Retained softness after cure for enhanced stress relief during thermal cycling
Excellent slump resistance (stays in place)
Repairable
Flame retardant: UL94V-0 equivalent
Glass bead options available (180 & 250μm) for bond line thickness (BLT) control

Applications

Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.

Đặc điểm	SilCool TIA241GF (A)	SilCool TIA241 GF (B)
Màu (thành phần A & thành phần B)	xanh	xanh nhạt
Độ nhớt *1 Pa•s	250	130
Tỷ lệ trộn theo trọng lượng	1:1	1:1
Độ nhớt sau khi trộn Pa•s	130	130
Chỉ số lưu biến	2.6	2.6
Thời gian thao tác ở 23°C (giờ)	3	3
Điều kiện khô (giờ) at 100 °C at 70 °C at 23 °C	0.25 0.50 24	0.25 0.50 24

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