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Liquid-Dispensed Silicone Thermal Pad / GapFiller SilCool* TIA282GF (XE14-TM009)

  • Product code: TIA282GF (XE14-TM009)
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XE14-TM009 is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. XE14-TM009 can be used as liquid dispensed alternative to prefabricated Thermal Pads, for a broad array of thermal designs in electronic applications.

KEY FEATURES
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable

APPLICATIONS 

Thermal interface for electronic components in Automotive, Consumer, Telecommunication,
Lighting and Industrial applications

Đặc điểm  XE14-TM009 (A)XE14-TM009 (B)
Màu (Part A & B)hồng hồng nhạt
Độ nhớt *1240235
Tỷ lệ trộn theo trọng lượng1:11:1
Độ nhớt sau khi trộn 275275
Chỉ số lưu biến 2.61.3
Thời gian thao tác @ 23°C (giờ) 11
Điều kiện khô (giờ) 
@ 70°C
@ 23°C		1
24		1
24

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