The ever-evolving technology leads to cutting-edge trends and constant changes in every industry. The electronics segment is witnessing the trend of increasingly compact, reliable, high-performance design.
Whether in consumer electronics, industrial electronics or semiconductor packaging, Prostech offers a comprehensive portfolio of specialty materials to make the designs of the future a reality.
What is die preparation? Die preparation is the procedure used to separate the wafer into individual dice to prepare it
Manufacturing and reliability challenges There are multiple challenges when it comes to wire bond manufacturing and reliability. These challenges tend
Chip Molding in Semiconductor
Challenges Solutions Liquid encapsulants Encapsulants are the last piece of the IC package and serve to protect the conductor and