BERGQUIST® GAP PAD® TGP 1500R

BERGQUIST® GAP PAD® TGP 1500R has the same highly conformable, low-modulus polymer as the standard BERGQUIST® GAP PAD® TGP 1500. The
fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for
good compliance to mating surfaces of components, further reducing thermal resistance.

FEATURES:

Thermal conductivity: 1.5 W/m-K
Fiberglass-reinforced for puncture, shear and tear resistance
Easy release construction
Electrically isolating

APPLICATIONS:

Telecommunications
Computers and peripherals
Power conversion
Memory modules / chip scale packages
Areas where heat needs to be transferred to a frame chassis or other type of heat spreader

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Black	Black	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (in.) / (mm)	0.010 to 0.020	0.254 to 0.508	ASTM D374
Inherent Surface Tack (1-sided)	2	2	—
Density, Bulk, Rubber (g/cc)	2.1	2.1	ASTM D792
Heat Capacity ( J/g-K)	1.3	1.3	ASTM E1269
Hardness, Bulk Rubber (Shore 00)	40	40	ASTM D2240
Young’s Modulus (psi) / (kPa)	45	310	ASTM D575
Continuous Use Temp. (°F) / (°C)	-76 to 392	-60 to 200	—
Dielectric Breakdown Voltage (VAC)	> 6,000	> 6,000	ASTM D149
Dielectric Constant (1,000 Hz)	6.0	6.0	ASTM D150
Volume Resistivity (Ω-m)	10^11	10^11	ASTM D257
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	1.5	1.5	ASTM D5470

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