Silicone Thermal Pad

Silicone Thermal Pad or called Silicone Based Gap Fillers are used to fill gaps of 0.1 – 10mm between surfaces and lower thermal resistance by excluding air from the interface, usually between heat-generating components (electronic components such as IC, CPU, MOS, LED) and heat sinks, heat spreaders or other cooling devices.
Our Silicone Thermal Pad and Silicone-Based Gap Filler  products have not only high thermal conductivity but also excellently compressive capacity of approx. 25% – 40% which helps to reduce pressure to electronic components