Liquid-Dispensed Silicone Thermal Pad / GapFiller SilCool* TIA268GF (XE14-C7413)

TIA268GF (XE14-C7413) is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. XE14-C7413 can be used as liquid dispensed alternative to prefabricated Thermal Pads, for a broad array of thermal designs in electronic applications.

Key Features
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable

Applications

Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.

Đặc điểm	(XE14-C7413) A	(XE14-C7413) B
Màu (Part A & B)	hồng	hồng nhạt
Độ nhớt *1	240	255
Tỷ lệ trộn theo trọng lượng	1:1	1:1
Độ nhớt sau khi trộn	250	250
Chỉ số lưu biến	1.5	1.5
Thời gian thao tác @ 23°C (giờ)	1	1
Điều kiện khô (giờ) @ 70°C @ 23°C	1 24	1 24

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