Electronic components need to be protected against moisture, dust dirt, vibration, and even temperature. Low Pressure Molding is an advanced method to take charge of this function with a gentle but reliable encapsulation around the electronic assemblies, especially the delicate ones.
Input the workpiece into the mold set.
Low-Pressure Molding System automatically molds the workpiece.
Take out the end-product as the mold is cold-down in seconds afterward.