BERGQUIST® GAP PAD® TGP 1300

BERGQUIST® GAP PAD® TGP 1300 is a highly compliant GAP PAD® material that is ideal for fragile component leads. The material is fiberglass-reinforced for improved puncture resistance and handling characteristics. BERGQUIST® GAP PAD® TGP 1300 maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. BERGQUIST® GAP PAD® TGP 1300 features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.

FEATURES:

Thermal conductivity: 1.3 W/m-K
Highly conformable/low hardness
Decreased strain on fragile components
Fiberglass-reinforced for puncture, shear and tear resistance
Quick rebound to original shape

APPLICATIONS:

Between any heat-generating component and a heat sink
Computers and peripherals
Telecommunications
Between any heat-generating semiconductor and a heat sink
Shielding devices

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Light Pink	Light Pink	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (in.) / (mm)	0.020 to 0.250	0.508 to 6.350	ASTM D374
Inherent Surface Tack (1-sided)	2	2	—
Density, Bulk, Rubber (g/cc)	1.8	1.8	ASTM D792
Heat Capacity ( J/g-K)	1.0	1.0	ASTM E1269
Hardness, Bulk Rubber (Shore 00)	30	30	ASTM D2240
Young’s Modulus (psi) / (kPa)	16	110	ASTM D575
Continuous Use Temp. (°F) / (°C)	-76 to 392	-60 to 200	—
Dielectric Breakdown Voltage (VAC)	> 6,000	> 6,000	ASTM D149
Dielectric Constant (1,000 Hz)	5.0	5.0	ASTM D150
Volume Resistivity (Ω-m)	10^11	10^11	ASTM D257
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	1.3	1.3	ASTM D5470

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