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BERGQUIST® GAP PAD® TGP A2000 Prostech Vietnam

BERGQUIST® GAP PAD® TGP A2000

  • Product code: TGP A2000
  • Manufacturer: Henkel
  • Package size: 0.254 to 1.016mm
  • Shelf Life: 6 months

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BERGQUIST® GAP PAD® TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mils, BERGQUIST® GAP PAD® TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mils material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.

FEATURES:

  • Thermal conductivity: 2.0 W/m-K
  • Fiberglass-reinforced for puncture, shear and tear resistance
  • Electrically isolating

APPLICATIONS:

  • Computers and peripherals; between CPU and heat spreader
  • Telecommunications
  • Heat pipe assemblies
  • Memory modules
  • CD-ROM and DVD cooling
  • Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
  • DDR SDRAM memory modules
PROPERTY   IMPERIAL VALUEMETRIC VALUETEST METHOD
ColorGreyGreyVisual
Reinforcement CarrierFiberglassFiberglass—
Thickness (in.) / (mm)0.010 to 0.0400.254 to 1.016 ASTM D374
Inherent Surface Tack (1-sided)22—
Density, Bulk, Rubber (g/cc)2.92.9ASTM D792
Heat Capacity ( J/g-K)1.01.0ASTM E1269
Hardness, Bulk Rubber (Shore 00)8080ASTM D2240
Young’s Modulus (psi) / (kPa)55379ASTM D575
Continuous Use Temp. (°F) / (°C)-76 to 392-60 to 200—
Dielectric Breakdown Voltage (VAC)4,0004,000ASTM D149
Dielectric Constant (1,000 Hz)6.06.0ASTM D150
Volume Resistivity (Ω-m)10^1110^11ASTM D257
Flame RatingV-OV-OUL 94
Thermal Conductivity (W/m-K)2.02.0ASTM D5470

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