BERGQUIST® GAP PAD® TGP A2000

BERGQUIST® GAP PAD® TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mils, BERGQUIST® GAP PAD® TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mils material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.

FEATURES:

• Thermal conductivity: 2.0 W/m-K
• Fiberglass-reinforced for puncture, shear and tear resistance
• Electrically isolating

APPLICATIONS:

• Computers and peripherals; between CPU and heat spreader
• Telecommunications
• Heat pipe assemblies
• Memory modules
• CD-ROM and DVD cooling
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
• DDR SDRAM memory modules