BERGQUIST® GAP PAD® TGP A2000

BERGQUIST® GAP PAD® TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mils, BERGQUIST® GAP PAD® TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mils material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.

FEATURES:

Thermal conductivity: 2.0 W/m-K
Fiberglass-reinforced for puncture, shear and tear resistance
Electrically isolating

APPLICATIONS:

Computers and peripherals; between CPU and heat spreader
Telecommunications
Heat pipe assemblies
Memory modules
CD-ROM and DVD cooling
Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
DDR SDRAM memory modules

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Grey	Grey	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (in.) / (mm)	0.010 to 0.040	0.254 to 1.016	ASTM D374
Inherent Surface Tack (1-sided)	2	2	—
Density, Bulk, Rubber (g/cc)	2.9	2.9	ASTM D792
Heat Capacity ( J/g-K)	1.0	1.0	ASTM E1269
Hardness, Bulk Rubber (Shore 00)	80	80	ASTM D2240
Young’s Modulus (psi) / (kPa)	55	379	ASTM D575
Continuous Use Temp. (°F) / (°C)	-76 to 392	-60 to 200	—
Dielectric Breakdown Voltage (VAC)	4,000	4,000	ASTM D149
Dielectric Constant (1,000 Hz)	6.0	6.0	ASTM D150
Volume Resistivity (Ω-m)	10^11	10^11	ASTM D257
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	2.0	2.0	ASTM D5470

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