This specialized two-component epoxy adhesive, EPO-TEK H70E-4, is engineered by Epoxy Technology, Inc. for high-demand electronic applications.
It expertly combines excellent thermal conductivity with robust electrical insulation, making it ideal for delicate semiconductor and micro-electronic assemblies.
Designed with a thixotropic, paste-like consistency, this epoxy is non-flowing and maintains adhesive strength even before curing, facilitating precise application.
Its versatile nature allows for use in heat-sinking power devices, bonding SMDs to PCBs, and crucial die attach processes in opto-electronic packaging.
Featuring a user-friendly 1:1 mix ratio and an extended pot life, this adhesive is suitable for both automated dispensing and screen printing methods, ensuring efficient workflow.
KEY FEATURES
Two-component system
Thermally conductive
Electrically insulating
Smooth thixotropic paste consistency
Non-flowing rheology
1:1 mix ratio by weight
Long pot life (2.5 days)
Suitable for automated dispensing and screen printing
Excellent adhesion to various metals and plastics
RECOMMENDED APPLICATIONS
PCB:
Bonding heat sinks; Adhesion to Al, Cu, most metals and plastics
Bonding SMDs to PCB; Adhesion to FR4, flex PCB, active and passive SMT packages; staking SMDs to PCB for double-sided circuits
Bonding ferrites and magnets for electronic sub-assemblies
Semiconductor: die attach onto substrates; COB and direct-chip attach.
Hybrid: bonding heat sinks and substrate to the metal case.
Opto-electronic: active alignment of optics and fiber optic components.
