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EPO-TEK H70E-4

EPO-TEK H70E-4

  • Product code: EPO-TEK H70E-4
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Product Description

  • This specialized two-component epoxy adhesive, EPO-TEK H70E-4, is engineered by Epoxy Technology, Inc. for high-demand electronic applications.
  • It expertly combines excellent thermal conductivity with robust electrical insulation, making it ideal for delicate semiconductor and micro-electronic assemblies.
  • Designed with a thixotropic, paste-like consistency, this epoxy is non-flowing and maintains adhesive strength even before curing, facilitating precise application.
  • Its versatile nature allows for use in heat sinking power devices, bonding SMDs to PCBs, and crucial die attach processes in opto-electronic packaging.
  • Featuring a user-friendly 1:1 mix ratio and an extended pot life, this adhesive is suitable for both automated dispensing and screen printing methods, ensuring efficient workflow.

Key Features

  • Two-component system
  • Thermally conductive
  • Electrically insulating
  • Smooth thixotropic paste consistency
  • Non-flowing rheology
  • 1:1 mix ratio by weight
  • Long pot life (2.5 days)
  • Suitable for automated dispensing and screen printing
  • Excellent adhesion to various metals and plastics

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