Product Description of EPO-TEK EK1000
- EPO-TEK EK1000 is a single-component, silver-filled epoxy adhesive engineered for exceptional thermal and electrical conductivity with a shiny silver appearance.
- Specifically designed for the demanding requirements of high power LED die attach applications, offering extreme thermal management capabilities.
- Features low viscosity combined with high thixotropy, making it ideal for a wide range of application techniques including syringe dispensing.
- Delivers outstanding resistance to thermal cycling and impact in high power microwave communications die attach applications.
- It is the single component version of EPO-TEK EK1000, also available in a Mil-STD-883 Test Method 5011 version: EPO-TEK EK1000-MP.
Key Features
- Single-component system for simplified processing
- Silver-filled for exceptional thermal and electrical conductivity
- Smooth thixotropic paste consistency
- Glass Transition Temperature (Tg) ≥ 80°C
- Ultra-high thermal conductivity up to 35.5 W/mK (with optimized cure)
- Extremely low volume resistivity ≤ 0.00009 Ohm-cm
- Long pot life of 2 weeks
- Suitable for syringe dispensing and automated application
EPO-TEK EK1000 Advantages & Suggested Application Notes
- Low viscosity and high thixotropy make it ideal for a wide range of application techniques including syringe dispensing.
- Extreme thermal management in high power and high brightness LED die attach.
- Resistant to thermal cycling and impact resistance in high power microwave communications die attach.
- Available in a Mil-STD-883 Test Method 5011 version: EPO-TEK EK1000-MP.
- Concentrated PV solar cells (CPV):
- Die attach of triple junction, III-V semiconductor chips, offering the lowest thermal resistance.
- Favorable performance with respect to solder devices.
- Replacing vacuum preform solder manufacturing with a proven low temperature/low stress, high volume dispensing process.
- Alternative step cures can result in improved thermal management. Contact techserv@epotek.com for selecting the best multi-step curing process.
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
PHYSICAL PROPERTIES
| Color (before cure) | Silver |
| Consistency | Smooth thixotropic paste |
| Viscosity (23°C) @ 100 rpm | 1,800 – 3,600 cPs |
| Thixotropic Index | 3.6 |
| Glass Transition Temp | ≥ 80 °C (Dynamic Cure: 20-300°C/ISO 25 Min; Ramp -10-200°C @20°C/Min) |
| Coefficient of Thermal Expansion (CTE) | |
| Below Tg | 38 x 10^-6 in/in°C |
| Above Tg | 94 x 10^-6 in/in°C |
| Shore D Hardness | 66 |
| Lap Shear @ 23°C | 1,010 psi |
| Die Shear @ 23°C (Initial) | ≥ 10 Kg / 3,556 psi |
| Die Shear @ 23°C (after 1000 hrs 85°C/85% RH) | ≥ 5 Kg / 1,778 psi |
| Die Shear @ 23°C (125°C/2 Hours) | ≥ 5 Kg / 1,778 psi |
| Degradation Temp | 357 °C |
| Weight Loss @ 200°C | 0.19 % |
| Weight Loss @ 250°C | 0.94 % |
| Weight Loss @ 300°C | 1.70 % |
| Suggested Operating Temperature | < 300 °C (Intermittent) |
| Storage Modulus | 273,528 psi |
| Ion Content: Cl⁻ | ≤ 10 ppm |
| Ion Content: Na⁺ | 2 ppm |
| Ion Content: NH₄⁺ | 6 ppm |
| Ion Content: K⁺ | 0 ppm |
| Particle Size | ≤ 45 microns |
ELECTRICAL AND THERMAL PROPERTIES
| Thermal Conductivity (150°C/1 Hour) | 12.6 W/mK |
| Thermal Conductivity (150°C/1 Hour + 200°C/1 Hour) | 26.3 W/mK |
| Thermal Conductivity (125°C/2.5 Hours + 150°C/36 Min + 200°C/15 Min) | 35.5 W/mK |
| Thermal Conductivity (125°C/2 Hours) | 5.56 W/mK |
| Volume Resistivity @ 23°C (150°C/1 Hour + 200°C/1 Hour) | ≤ 0.00009 Ohm-cm |
| Volume Resistivity @ 23°C (125°C/2 Hours) | 0.00007 Ohm-cm |
| Dielectric Constant (1KHz) | N/A |
| Dissipation Factor (1KHz) | N/A |
