Using potting compound for effective potting of electronics to protect against environmental influences, improve not only mechanical strength but also high electrical insulation. Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits:
Electrical Insulation
Enhanced Mechanical Strength
Heat dissipation
Corrosion protection
Chemical protection
Environmental influences
Potting – Encapsulant
Gluditec UV5200
- Product code: UV5200
- Manufacturer: Gluditec Materials
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H.B. Fuller Polyurethane Foam 4006
- Product code: 4006
- Manufacturer: H. B. Fuller
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Yincae Encapsulant UVA 88E Series
- Product code: 88E Series
- Manufacturer: YINCAE
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Yincae Optical Bonding WL 66L
- Product code: 66L
- Manufacturer: YINCAE
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YINCAE Solder Joint Encapsulants SMT 266
- Product code: SMT 266
- Manufacturer: YINCAE
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YINCAE Solder Joint Encapsulants SMT 256
- Product code: SMT 256
- Manufacturer: YINCAE
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YINCAE Solder Joint Encapsulants SMT 256 BC
- Product code: 256 BC
- Manufacturer: YINCAE
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YINCAE Solder Joint Encapsulants SMT 138
- Product code: SMT 138
- Manufacturer: YINCAE
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YINCAE Solder Joint Encapsulant Paste SMT 256 EP
- Product code: SMT 256 EP
- Manufacturer: YINCAE
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