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Home > Industries > Printed Circuit Board Solutions > PCB Assembly > Yincae NF 160 L
YINCAE

Yincae NF 160 L

  • Product code: L
  • Manufacturer: YINCAE
  • Package size:
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  • General Information of Yincae NF 160 L
  • Key Features of Yincae NF 160 L
  • Key Applications
  • About Prostech

Yincae NF 160 L is a cutting-edge, low-temperature reflowable underfill designed to revolutionize high-speed electronic production. This advanced material provides exceptional mechanical protection and ensures a high process yield, making it an ideal solution for sensitive electronic components in demanding applications like BGA, CSP, and flip-chip assemblies. Prostech.vn offers this innovative solution to enhance the reliability and efficiency of your electronic manufacturing processes.

General Information of Yincae NF 160 L

Yincae NF 160 L is specifically engineered as a low-temperature, reflowable underfill, offering fast application and robust mechanical protection for sensitive electronic components. It is perfectly suited for high-speed production environments, streamlining manufacturing by combining soldering and underfilling into a single process. This underfill is fully compatible with no-clean flux residues, eliminating the need for additional cleaning steps and preventing solder joint deformation even after multiple reflow cycles. The robust performance of Yincae NF 160 L ensures enhanced reliability and durability for advanced electronic assemblies, including CSP, BGA, and flip-chip applications.

Key Features of Yincae NF 160 L

  • Low-Temperature Reflowable: Yincae NF 160 L combines soldering and underfilling in a single process, optimizing manufacturing efficiency and making it suitable for temperature-sensitive components.
  • Strong Mechanical Protection: Delivers enhanced component reliability and superior impact resistance, significantly reducing the risk of solder joint failure under thermal cycling and mechanical stress.
  • High Process Yield: Designed for high-speed production environments, ensuring fast application and consistent coverage without void formation, even in high-density assemblies.

Key Applications

  • Ball Grid Array (BGA) devices
  • Chip Scale Package (CSP) assemblies
  • Flip Chip applications
  • Package-on-Package (PoP)
  • Sensitive electronic components in high-speed production

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

PropertyValue
Viscosity8-10kcp
Curing Conditions150°C
Tg (°C)135
C.T.E65 ppm/k

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    Yincae NF 160 L

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      Yincae NF 160 L

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