INVISISIL TSE3033 is a high-performance, two-component, transparent heat curable silicone rubber. It is specifically engineered for critical electrical and electronic potting applications. This advanced formulation delivers robust protection and ensures reliable performance in demanding industrial environments. Furthermore, it offers exceptional primerless adhesion to a wide array of substrates, simplifying manufacturing processes and enhancing product longevity.
General Information of INVISISIL TSE3033
INVISISIL TSE3033 consists of two distinct liquid components, designated A and B. These components combine effortlessly in a convenient 1:1 mix ratio by weight. This low-viscosity characteristic is crucial; it permits excellent potting, ensuring thorough material penetration around intricate electronic components. The silicone rubber cures efficiently with heat, transforming into a durable, elastic, and transparent solid. Consequently, it provides superior environmental sealing, mechanical protection, and vibration dampening for sensitive assemblies. This material adheres effectively to diverse substrates, including various metals, plastics, glass, and ceramics, without requiring a primer. Importantly, its curing process generates no reactive by-products, thereby eliminating concerns regarding corrosion or degradation of encapsulated parts. This ensures long-term reliability for critical electronic systems.
Key Features & Technical Benefits
- Convenient 1:1 Mix Ratio: Simplifies preparation and reduces potential for mixing errors, optimizing production efficiency.
- Low Viscosity: Permits excellent potting, ensuring thorough encapsulation and void-free protection of complex geometries.
- Transparent Appearance: Allows for clear visual inspection of encapsulated components, aiding quality control and troubleshooting.
- Primerless Adhesion: Bonds directly to a wide variety of materials, streamlining assembly processes and reducing material costs.
- No Reactive By-products: Prevents corrosion and ensures long-term component integrity, enhancing device lifespan.
- Excellent Temperature Resistance: Maintains stable performance across extreme thermal cycles, ensuring reliability in harsh conditions.
Typical Industrial Applications
This formulation is engineered for the following applications:
- Potting of electronics parts requiring resistance to temperature extremes
- Potting of high voltage parts
- Moistureproof coating of electronic circuit boards
- Potting of various modules
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| Property | Value |
| Uncured Appearance (Component A) | Transparent liquid |
| Uncured Appearance (Component B) | Transparent liquid |
| Viscosity (23 ºC, Component A) | 1.1 Pa•s {11 P} |
| Viscosity (23 ºC, Component B) | 0.8 Pa•s {8 P} |
| Mix Ratio by Weight | 1:1 |
| Viscosity After Mixing (23 ºC) | 0.9 Pa•s {9 P} |
| Work Life (23 ºC) | 6 h |
| Cured Appearance (0.5h at 150 ºC) | Elastic rubber |
| Density (23 ºC) | 1.01 g/cm³ |
| Hardness (Type A) | 30 |
| Tensile Strength | 1.0 MPa {10 kgf/cm²} |
| Elongation | 130 % |
| Adhesive Strength (Glass Lap Shear) | 0.3 MPa {3 kgf/cm²} |
| Refractive Index (nD 25) | 1.407 |
| Linear Expansion | 2.3 x 10⁻⁴ 1/K |
| Thermal Conductivity | 0.17 W/(m•K) |
| Transmittance (450-800nm, 10mm) | 95 % |
| Volume Resistivity | 2.0 x 10¹⁵ Ω•cm |
| Dielectric Strength | 21 kV/mm |
| Dielectric Constant (60Hz) | 2.8 |
| Dissipation Loss (60Hz) | 0.001 |
