Potting – Encapsulant

Using potting compound for effective potting of electronics to protect against environmental influences, improve not only mechanical strength but also high electrical insulation. Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits:
Electrical Insulation
Enhanced Mechanical Strength
Heat dissipation
Corrosion protection
Chemical protection
Environmental influences

LOCTITE ECCOBOND EO-1072

LOCTITE ECCOBOND EO-1072

  • Product code: EO-1072
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TSE3925-C

TSE3925-C

  • Product code: TSE3925-C
  • Manufacturer: Momentive
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INVISISIL TSE3033

INVISISIL TSE3033

  • Product code: TSE3033
  • Manufacturer: Momentive
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gluditec

Gluditec UV5200

  • Product code: UV5200
  • Manufacturer: Gluditec
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4006

H.B. Fuller Polyurethane Foam 4006

  • Product code: 4006
  • Manufacturer: H. B. Fuller
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Yincae Encapsulant UVA 88E Series

  • Product code: 88E Series
  • Manufacturer: YINCAE
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Yincae Optical Bonding WL 66L

  • Product code: 66L
  • Manufacturer: YINCAE
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YINCAE

Yincae NF 160 L

  • Product code: NF 160L
  • Manufacturer: YINCAE
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YINCAE

Yincae EN 158B2

  • Product code: 158B2
  • Manufacturer: YINCAE
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YINCAE

YINCAE Solder Joint Encapsulants SMT 266

  • Product code: SMT 266
  • Manufacturer: YINCAE
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YINCAE

YINCAE Solder Joint Encapsulants SMT 256

  • Product code: SMT 256
  • Manufacturer: YINCAE
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