This specialized product from Everwide is a single-component, reworkable epoxy adhesive engineered for resilient bonding in diverse electronic applications.
Designed for versatility, it excels in tasks like casting, sealing, and securely underfilling BGA and CSP chips, effectively mitigating thermal and mechanical stress.
Achieve significant operational efficiency with its rapid high-temperature curing capabilities, reducing cycle times without compromising bond integrity.
It forms remarkably tough, structurally sound bonds exhibiting exceptional resistance to shear, peel, and impact, ensuring longevity and reliability through rigorous environmental testing.
Key Features
Formulated as a solvent-free system, completely non-volatile, and free from toxic emissions during application.
Features a low viscosity combined with excellent fluidity, ensuring straightforward and efficient application processes.
The cured surface is free from undesirable oiliness and maintains a consistent, attractive gloss.
Demonstrates high reactivity when exposed to temperatures exceeding 150°C, facilitating rapid processing.
Provides outstanding rebound, fatigue, and crack resistance, crucial for demanding electronic component protection.
Fully compliant with the strict 2011/65/EU RoHS regulations, meeting global environmental standards.
Meets stringent halogen-free requirements, with chlorine content below 900ppm, bromine below 900ppm, and total halogens less than 1500ppm.
