An innovative dual-photo-curing adhesive from Everwide Chemical, meticulously engineered to ensure comprehensive and robust bonding even when UV light cannot fully penetrate.
This advanced solution employs a unique moisture reaction mechanism to achieve complete curing in shadowed regions, effectively preventing any unreacted monomers that might otherwise compromise crucial electrical performance.
Ideally suited for the demanding electronic industry, offering rapid-curing capabilities for efficient mass production and providing reliable reinforcement for intricate PVC/PET/PI connectors with metal components.
The formulation delivers exceptional flexibility, adeptly absorbing impact fracture energy, complemented by outstanding water resistance and the capacity to perform across a broad operating temperature range.
Developed in strict adherence to 2011/65/EU RoHS regulations, this adhesive underscores a commitment to environmental responsibility and ensures safety in a wide array of advanced electronic applications.
Key Features
Possesses a dual curing mechanism, utilizing both UV light and environmental moisture.
Versatile for bonding various types of plastics effectively.
Exhibits excellent resistance to water exposure.
Provides flexibility and superior impact fracture energy absorption.
Functions reliably across a wide operational temperature spectrum.
Fully compliant with the 2011/65/EU RoHS regulations.
