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BERGQUIST® GAP PAD® TGP 1500R Prostech Vietnam

BERGQUIST® GAP PAD® TGP 1500R

  • Product code: TGP 1500R
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months

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BERGQUIST® GAP PAD® TGP 1500R has the same highly conformable, low-modulus polymer as the standard BERGQUIST® GAP PAD® TGP 1500. The
fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for
good compliance to mating surfaces of components, further reducing thermal resistance.

FEATURES:

  • Thermal conductivity: 1.5 W/m-K
  • Fiberglass-reinforced for puncture, shear and tear resistance
  • Easy release construction
  • Electrically isolating

APPLICATIONS:

  • Telecommunications
  • Computers and peripherals
  • Power conversion
  • Memory modules / chip scale packages
  • Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
PROPERTY   IMPERIAL VALUEMETRIC VALUETEST METHOD
ColorBlackBlackVisual
Reinforcement CarrierFiberglassFiberglass—
Thickness (in.) / (mm)0.010 to 0.0200.254 to 0.508 ASTM D374
Inherent Surface Tack (1-sided)22—
Density, Bulk, Rubber (g/cc)2.12.1ASTM D792
Heat Capacity ( J/g-K)1.31.3ASTM E1269
Hardness, Bulk Rubber (Shore 00)4040ASTM D2240
Young’s Modulus (psi) / (kPa)45310ASTM D575
Continuous Use Temp. (°F) / (°C)-76 to 392-60 to 200—
Dielectric Breakdown Voltage (VAC)> 6,000> 6,000ASTM D149
Dielectric Constant (1,000 Hz)6.06.0ASTM D150
Volume Resistivity (Ω-m)10^1110^11ASTM D257
Flame RatingV-OV-OUL 94
Thermal Conductivity (W/m-K)1.51.5ASTM D5470

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