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BERGQUIST GAP FILLER TGF 3010APS

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  • Manufacturer: Henkel
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  • Shelf Life: 3 months

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BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent silicone-free solution critical to power storage applications using lithium ion batteries. This material is an exceptional choice for use in auto and consumer applications.

 

Technology Silicone free
Appearance – Part A Black
Appearance – Part B White
Appearance (cured) Black
Cure Room temperature cure or Heat cure
Application Thermal management, Gap Filler (2K)
Mix Ratio by weight: Part A: Part B 1 : 1
Mix Ratio by volume: Part A: Part B 1 : 1
Operating Temperature Range -40 to 80ºC

 

Feartures and benefits

● Thermal Conductivity: 3.0 W/m-K
● Dispensable liquid, 2K Silicone free Gap Filler
● Room temperature cure – no oven required
● Extremely high dispense rate: >40 cc/sec
● Low compression stress during assembly

TYPICAL APPLICATIONS

● Automotive power storage
● Silicone sensitive applications
● Processes requiring high dispense rate
● Applications requiring high thermal transfer and low compressive stress

TYPICAL UNCURED PROPERTIES BERGQUIST GAP FILLER TGF 3010APS Part A

Viscosity, mPa·s (cP):  
  High shear rate 3000 s^-1, ASTM D5099 5,000
  Low shear rate 1.0 s^-1 , DIN 53019 425,000
Density, ASTM D792, g/cc 3.0
Storage Life @ 25°C, days 90

BERGQUIST GAP FILLER TGF 3010APS Part B

Viscosity, mPa·s (cP):  
  High shear rate 3000 s^-1, ASTM D5099 20,000
  Low shear rate 1.0 s^-1 , DIN 53019 650,000
Density, ASTM D792, g/cc 3.0
Storage Life @ 25°C, days 90

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties
Hardness, Shore 00, 6.35 mm thick sample 75
Heat Capacity, ASTM D1269, J/g-K 0.87
Flammability, UL 94 V-0
Siloxane Content, ΣD4-D10 , ASTM F2466, ppm ND
Electrical Properties
Dielectric Strength, ASTM D149, V/mm 14,000
Dielectric Constant , ASTM D150 @ 1000 Hz 17
Volume Resistivity, ASTM D257, ohm-meter 1×10^6
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 3.0

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