BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent silicone-free solution critical to power storage applications using lithium ion batteries. This material is an exceptional choice for use in auto and consumer applications.
| Technology | Silicone free |
| Appearance – Part A | Black |
| Appearance – Part B | White |
| Appearance (cured) | Black |
| Cure | Room temperature cure or Heat cure |
| Application | Thermal management, Gap Filler (2K) |
| Mix Ratio by weight: Part A: Part B | 1 : 1 |
| Mix Ratio by volume: Part A: Part B | 1 : 1 |
| Operating Temperature Range | -40 to 80ºC |
Feartures and benefits
● Thermal Conductivity: 3.0 W/m-K
● Dispensable liquid, 2K Silicone free Gap Filler
● Room temperature cure – no oven required
● Extremely high dispense rate: >40 cc/sec
● Low compression stress during assembly
TYPICAL APPLICATIONS
● Automotive power storage
● Silicone sensitive applications
● Processes requiring high dispense rate
● Applications requiring high thermal transfer and low compressive stress
TYPICAL UNCURED PROPERTIES BERGQUIST GAP FILLER TGF 3010APS Part A
| Viscosity, mPa·s (cP): | |
| High shear rate 3000 s^-1, ASTM D5099 | 5,000 |
| Low shear rate 1.0 s^-1 , DIN 53019 | 425,000 |
| Density, ASTM D792, g/cc | 3.0 |
| Storage Life @ 25°C, days | 90 |
BERGQUIST GAP FILLER TGF 3010APS Part B
| Viscosity, mPa·s (cP): | |
| High shear rate 3000 s^-1, ASTM D5099 | 20,000 |
| Low shear rate 1.0 s^-1 , DIN 53019 | 650,000 |
| Density, ASTM D792, g/cc | 3.0 |
| Storage Life @ 25°C, days | 90 |
TYPICAL PROPERTIES OF CURED MATERIAL
| Physical Properties | |
| Hardness, Shore 00, 6.35 mm thick sample | 75 |
| Heat Capacity, ASTM D1269, J/g-K | 0.87 |
| Flammability, UL 94 | V-0 |
| Siloxane Content, ΣD4-D10 , ASTM F2466, ppm | ND |
| Electrical Properties | |
| Dielectric Strength, ASTM D149, V/mm | 14,000 |
| Dielectric Constant , ASTM D150 @ 1000 Hz | 17 |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10^6 |
| Thermal Properties | |
| Thermal Conductivity, ASTM D5470, W/(m-K) | 3.0 |
