Home > Products > By Market > Consumer Products > BERGQUIST GAP FILLER TGF 3010APS
BERGQUIST GAP FILLER TGF 3010APS Prostech Vietnam

BERGQUIST GAP FILLER TGF 3010APS

  • Product code: 3010APS
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 3 months

Request Quote Request Sample

BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent silicone-free solution critical to power storage applications using lithium ion batteries. This material is an exceptional choice for use in auto and consumer applications.

 

TechnologySilicone free
Appearance – Part ABlack
Appearance – Part BWhite
Appearance (cured)Black
CureRoom temperature cure or Heat cure
ApplicationThermal management, Gap Filler (2K)
Mix Ratio by weight: Part A: Part B1 : 1
Mix Ratio by volume: Part A: Part B1 : 1
Operating Temperature Range-40 to 80ºC

 

Feartures and benefits

● Thermal Conductivity: 3.0 W/m-K
● Dispensable liquid, 2K Silicone free Gap Filler
● Room temperature cure – no oven required
● Extremely high dispense rate: >40 cc/sec
● Low compression stress during assembly

TYPICAL APPLICATIONS

● Automotive power storage
● Silicone sensitive applications
● Processes requiring high dispense rate
● Applications requiring high thermal transfer and low compressive stress

TYPICAL UNCURED PROPERTIES BERGQUIST GAP FILLER TGF 3010APS Part A

Viscosity, mPa·s (cP): 
  High shear rate 3000 s^-1, ASTM D50995,000
  Low shear rate 1.0 s^-1 , DIN 53019425,000
Density, ASTM D792, g/cc3.0
Storage Life @ 25°C, days90

BERGQUIST GAP FILLER TGF 3010APS Part B

Viscosity, mPa·s (cP): 
  High shear rate 3000 s^-1, ASTM D509920,000
  Low shear rate 1.0 s^-1 , DIN 53019650,000
Density, ASTM D792, g/cc3.0
Storage Life @ 25°C, days90

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties
Hardness, Shore 00, 6.35 mm thick sample75
Heat Capacity, ASTM D1269, J/g-K0.87
Flammability, UL 94V-0
Siloxane Content, ΣD4-D10 , ASTM F2466, ppmND
Electrical Properties
Dielectric Strength, ASTM D149, V/mm14,000
Dielectric Constant , ASTM D150 @ 1000 Hz17
Volume Resistivity, ASTM D257, ohm-meter1×10^6
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K)3.0

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    YINCAE Solder Joint Encapsulants SMT 266
    YINCAE Solder Joint Encapsulants SMT 266
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-266/

    Key Features of YINCAE Solder Joint Encapsulants SMT 266Applications for YINCAE Solder Joint Encapsulants SMT 266 Introducing YINCAE Solder Joint

    YINCAE Solder Joint Encapsulants SMT 256
    YINCAE Solder Joint Encapsulants SMT 256
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256/

    Elevate Reliability with YINCAE Solder Joint Encapsulants SMT 256Key Features & BenefitsApplications of YINCAE Solder Joint Encapsulants SMT 256 YINCAE

    YINCAE Solder Joint Encapsulants SMT 256 BC
    YINCAE Solder Joint Encapsulants SMT 256 BC
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256-bc/

    Why Choose YINCAE Solder Joint Encapsulants SMT 256 BC?Key Applications YINCAE Solder Joint Encapsulants SMT 256 BC is a cutting-edge

    YINCAE Solder Joint Encapsulants SMT 138
    YINCAE Solder Joint Encapsulants SMT 138
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-138/

    Key Features of YINCAE Solder Joint Encapsulants SMT 138Versatile Applications YINCAE Solder Joint Encapsulants SMT 138 is a cutting-edge, low-temperature