Yincae Non-Conductive DA 90B is a high-performance, one-component thermosetting insulating adhesive specifically engineered for secure and efficient LED (GaN) bonding in modern electronic assemblies. This advanced die attach material ensures exceptional adhesion, long-term reliability, and efficient heat dissipation, optimizing device performance and extending operational life.
General Information of Yincae Non-Conductive DA 90B
Yincae Non-Conductive DA 90B is a specialized one-component, thermosetting insulating adhesive designed for critical LED (GaN) bonding applications. As part of YINCAE’s advanced die attach solutions, it provides secure and efficient bonding of semiconductor dies to various substrates. This material is formulated to meet the stringent demands of modern electronic assemblies, ensuring high thermal performance, excellent adhesion, and long-term reliability without electrical conductivity.
Key Features of Yincae Non-Conductive DA 90B
- Non-Conductive Insulation: Specifically designed as an insulating adhesive, preventing electrical interference in sensitive electronic components.
- One-Component Thermosetting: Simplifies application and processing, curing thermally at 150°C for efficient manufacturing.
- High Mechanical Strength & Reliability: Provides robust adhesion and maintains bond integrity under stress, with resistance to harsh environments.
Key Applications
- LED (GaN) Bonding
- Semiconductor Die Attach
- Electronic Component Assembly
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
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| Property | Value |
| Type | Non-Conductive |
| Appearance | Gray |
| Thermal Conductivity (W/mK) | N/A |
| Tg (°C) | N/A |
| Application Method | Dispense |
| Cure Temperature Range | 150°C |
| Key Features | One-component, thermosetting insulating adhesive for LED (GaN) bonding |