Yincae Non-Conductive DA 158N is an advanced silica-filled, non-conductive die attach adhesive specifically engineered for secure and efficient bonding of semiconductor dies to various substrates. This material ensures reliable adhesion and effective thermal management, crucial for modern electronic assemblies requiring high performance and long-term stability.
General Information of Yincae Non-Conductive DA 158N
Yincae Non-Conductive DA 158N is a high-performance, silica-filled, non-conductive die attach material designed for critical electronic bonding applications. It provides robust adhesion and thermal insulation, making it ideal for semiconductor dies where electrical isolation is paramount. This advanced adhesive ensures the secure attachment of components to substrates like copper, aluminum, glass, and ceramic, contributing to the overall reliability and performance of electronic devices. The formulation of Yincae Non-Conductive DA 158N is optimized to reduce process complexity, eliminating the need for solder flux or additional cleaning steps.
Key Features of Yincae Non-Conductive DA 158N
- Non-Conductive Formulation: Yincae Non-Conductive DA 158N is specifically designed to provide electrical insulation while ensuring strong mechanical bonding for sensitive electronic components.
- Reliable Thermal Management: Offers effective thermal conductivity of 58 W/mK, facilitating efficient heat dissipation in applications requiring electrical isolation.
- High Mechanical Strength: Provides exceptional adhesion to various substrates, ensuring bond integrity and long-term reliability under demanding operational conditions.
Key Applications
- Semiconductor Die Bonding
- LED (GaN) Bonding
- Electronic Component Assembly requiring electrical insulation
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
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| Property | Value |
| Product Name | DA 158N |
| Appearance | Off-white |
| Thermal Conductivity | 58 W/mK |
| Tg | N/A |
| Application Method | Dispense |
| Cure Temperature Range | 150°C |
| Key Features | Silica-filled, non-conductive |
