Yincae Non-Conductive DA 120 is an advanced silica-filled die attach adhesive, specifically engineered to provide secure and reliable bonding for semiconductor dies to various substrates. This high-performance material ensures exceptional adhesion and long-term stability, crucial for modern electronic assemblies requiring non-conductive solutions.
General Information of Yincae Non-Conductive DA 120
Yincae Non-Conductive DA 120 is a specialized die attach material designed for applications where electrical insulation is paramount. As a silica-filled, non-conductive adhesive, it provides robust mechanical strength and excellent adhesion for bonding semiconductor dies to substrates like copper, aluminum, glass, and ceramic. This material is part of YINCAE’s advanced adhesive portfolio, ensuring reliable performance in demanding electronic environments without compromising electrical isolation.
Key Features of Yincae Non-Conductive DA 120
- Non-Conductive Formulation: Specifically designed as a silica-filled, non-conductive adhesive, ensuring electrical isolation between components.
- Strong Adhesion: Provides excellent mechanical strength and reliable bonding to various substrates, crucial for long-term device integrity.
- Thermal Curing: Optimized for thermal curing at 120°C, allowing for controlled and efficient processing in manufacturing.
Key Applications
- Die attach for semiconductor components requiring electrical insulation.
- Bonding in electronic assemblies where non-conductive properties are critical.
- Applications demanding high mechanical strength and reliability for component attachment.
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
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| Property | Value |
| Product Name | DA 120 |
| Appearance | Gray |
| Thermal Conductivity (W/mK) | N/A |
| Tg (°C) | N/A |
| Application Method | Dispense |
| Cure Temperature Range | 120°C |
| Key Features | Silica-filled, non-conductive |



