Product Introduction
NF 160 Reflowable Underfill is an innovative material that combines soldering and underfilling processes into a single, efficient step. Designed for high-temperature soldering reflow processes like SAC, it is ideal for chip scale packages, ball grid array devices, package on package, land grid array, and certain flip chip applications. This versatile underfill also provides bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits, and multi-chip modules. Engineered for high-production environments where process speed and mechanical shock resistance are critical, NF 160 Reflowable Underfill minimizes induced stresses, offers outstanding reliability (e.g., temperature cycling performance), and excellent mechanical resistance, significantly improving drop test performance compared to solder paste alone.
NF 160 Reflowable Underfill Key Features
- Combines soldering and underfilling in one process.
- Designed for high-temperature reflow processes (e.g., SAC).
- Enhances component reliability and mechanical shock resistance.
- Minimizes induced stresses.
- Suitable for various advanced packages including CSP, BGA, PoP, LGA, and flip chip.
- Applicable via dispense, dip, or print methods.
- Low cost of ownership.
NF 160 Reflowable Underfill Applications
- Chip Scale Package (CSP)
- Ball Grid Array (BGA) devices
- Package on Package (PoP)
- Land Grid Array (LGA)
- Flip Chip applications
- Bare chip protection in memory cards, chip carriers, hybrid circuits, and multi-chip modules.
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
