Yincae Encapsulant UVA 88E Series is a high-performance, dual-cure encapsulant designed for critical optoelectronic applications. This advanced material ensures robust protection and exceptional optical clarity. It delivers reliable long-term performance in demanding industrial environments.
General Information of Yincae Encapsulant UVA 88E Series
Yincae Encapsulant UVA 88E Series is a sophisticated, dual-cure material. It combines rapid UV curing with an optional thermal post-cure. This ensures maximum reliability for sensitive components. Furthermore, its advanced formulation provides exceptional optical clarity. It also maintains strong adhesion across various substrates, including glass, metal, and polymers. Consequently, this encapsulant minimizes thermal stress on delicate devices. The material’s robust chemical base ensures stable performance. It resists environmental factors effectively. This makes it suitable for demanding industrial applications.
Key Features & Technical Benefits
- High Adhesion & Low Moisture Absorption: This encapsulant forms robust bonds. It exhibits minimal moisture uptake. This ensures long-term performance and reliability, even in high-humidity environments.
- Ultra-Fast UV Curing with Dual Cure Option: Achieve instant curing within seconds using UV light. An optional thermal post-cure further enhances mechanical properties and overall device reliability. This dual-cure capability offers significant manufacturing flexibility.
- Exceptional Optical Clarity: The formulation maintains high transparency. It exhibits minimal yellowing over time. This makes it ideal for applications requiring pristine optical pathways and visual performance.
- Superior Moisture Resistance: The material provides outstanding humidity resistance. It withstands conditions like 85°C/85% RH for extended periods. This significantly extends the operational lifespan of encapsulated devices.
- Low Thermal Stress: The encapsulant’s properties are optimized to minimize stress on delicate components. This protects sensitive substrates from damage during thermal cycling.
- High Refractive Index & Low Shrinkage: It offers a high refractive index. Minimal shrinkage occurs during curing. This maintains precise optical alignment, critical for advanced optoelectronic devices.
Typical Industrial Applications
This formulation is engineered for the following applications:
- Optical & Fiber Optic Devices
- Lens Attachment
- LCD Lamination
- Touch Screen Bonding
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
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| Property | Value |
| Type | Encapsulant |
| Cure Method | UV + Thermal |
| Tg (°C) | 120 |
| CTE (ppm/°C) | 65 |
| Special Features | High adhesion, low moisture absorption |
