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Home > Products > By Application > Adhesives > Yincae Conductive DA 120F
YINCAE-industrial-materials

Yincae Conductive DA 120F

  • Product code: 120F
  • Manufacturer: YINCAE
  • Package size:
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  • General Information of Yincae Conductive DA 120F
  • Key Features of Yincae Conductive DA 120F
  • Key Applications
  • About Prostech

Yincae Conductive DA 120F is a silver-filled, high-reliability die attach material designed to meet the stringent demands of modern electronic assemblies. This advanced adhesive ensures secure and efficient bonding of semiconductor dies to various substrates, delivering exceptional thermal and electrical conductivity, robust adhesion, and superior long-term reliability for high-performance devices. When seeking optimal performance, Yincae Conductive DA 120F stands out as a premier choice.

General Information of Yincae Conductive DA 120F

YINCAE’s die attach materials, including Yincae Conductive DA 120F, are engineered for the secure and efficient bonding of semiconductor dies to various substrates. These advanced adhesives are crucial for applications requiring high thermal and electrical conductivity, excellent adhesion, and long-term reliability. They are specifically designed to address the stringent demands of modern electronic assemblies, such as high-power devices, LEDs, CSPs (Chip Scale Packages), QFPs (Quad Flat Packages), and heat spreader bonding. Our solutions simplify the manufacturing process by eliminating the need for solder flux, cleaning steps, or additional underfill, leading to improved device performance, extended operational life, and reduced total manufacturing costs.

Key Features of Yincae Conductive DA 120F

  • Silver-filled, High Reliability: Specifically for Yincae Conductive DA 120F, ensuring robust and durable connections for critical electronic components.
  • Superior Electrical Conductivity: Offers electrical conductivity matching metal surfaces, ideal for high-performance electronic assemblies.
  • Exceptional Thermal Conductivity: Facilitates efficient heat dissipation, crucial for high-power applications.
  • High Mechanical Strength: Provides excellent adhesion to various substrates, maintaining bond integrity under stress.

Key Applications

  • Bonding of semiconductor dies to various substrates
  • High-power devices and LEDs
  • CSPs (Chip Scale Packages) and QFPs (Quad Flat Packages)
  • Heat spreader bonding applications

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

PropertyValue
Product NameDA 120F
AppearanceSilver
Thermal Conductivity (W/mK)79
Tg (°C)N/A
Application MethodPin transfer
Cure Temperature Range230°C
Key FeaturesSilver-filled, high reliability

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