Yincae ACP 158 is an innovative solderable underfill material engineered to provide superior protection and enhanced reliability for advanced electronic assemblies. This cutting-edge solution streamlines manufacturing by combining soldering and underfilling into a single, efficient process, optimizing performance for CSP, BGA, PoP, and flip-chip applications.
General Information of Yincae ACP 158
Yincae ACP 158 is specifically formulated as a solderable underfill, allowing for the integration of soldering and underfilling steps. This unique capability significantly enhances manufacturing efficiency and component reliability. It is designed to be compatible with no-clean flux residues, eliminating the need for additional cleaning processes. The material ensures robust protection against solder joint deformation, even after multiple reflow cycles, and offers exceptional durability across extreme temperature ranges. Yincae ACP 158 is ideal for high-density electronic packaging, providing consistent coverage and void-free underfilling.
Key Features of Yincae ACP 158
- Combined Soldering & Underfilling: Optimizes manufacturing efficiency by integrating two critical processes into one.
- Extreme Thermal Stability: Operates reliably across a wide temperature range from -273°C to over 400°C, suitable for demanding thermal environments.
- Advanced Mechanical Shock Resistance: Delivers outstanding drop-test performance with durability two orders of magnitude higher than standard solder paste.
Key Applications
- CSP (Chip Scale Package) applications
- BGA (Ball Grid Array) applications
- Flip-chip applications
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
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- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
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| Property | Value |
| Description | Solderable Underfill |
| Viscosity | 280-600kcp |
| Curing Conditions | 120-150°C |
| Tg | 156 °C |
| CTE | 22 ppm/K |
