Weldtone DA21101 epoxy die attach adhesive is specially formulated for small to medium size packages. It is a white, heat curable, non conductive adhesive with low resin bleed and low voiding during the curing process. It has moderate stress absorbing capabilities and can dispense with minimal tailing and stringing.
FEATURE
- Low temp cure
- Low Warpage
APPLICATION
Die attachment in Camera
Properties | |
Product name | DA21101 |
Chemistry | Epoxy |
Mix Ratio | One Part |
Color | Red |
Curing Condition | 30 min @ 80ºC |
Viscosity (cps) | 2500 – 4500 |
Open Time | N/A |
Tg (TMA) | 25ºC |
CTE1 / CTE2 | N/A |
Young’s Modulus @ 25℃ (Mpa) | 254 |
Overlap Shear Adhesion (Mpa) | 10.3 (FR4 + FR4) |
Elongation | 0.65 |
