WELDTONE DA21101 Low temp. Epoxy Adhesive

Weldtone DA21101 epoxy die attach adhesive is specially formulated for small to medium size packages. It is a white, heat curable, non conductive adhesive with low resin bleed and low voiding during the curing process. It has moderate stress absorbing capabilities and can dispense with minimal tailing and stringing.

FEATURE

Low temp cure
Low Warpage

APPLICATION

Die attachment in Camera

Properties
Product name	DA21101
Chemistry	Epoxy
Mix Ratio	One Part
Color	Red
Curing Condition	30 min @ 80ºC
Viscosity (cps)	2500 – 4500
Open Time	N/A
Tg (TMA)	25ºC
CTE1 / CTE2	N/A
Young’s Modulus @ 25℃ (Mpa)	254
Overlap Shear Adhesion (Mpa)	10.3 (FR4 + FR4)
Elongation	0.65

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