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Home > Products > By Application > Thermal Management > TIA2101GF 2K Thermally Conductive Gap Filler
TIA2101GF 2K Thermally Conductive Gap Filler Prostech Vietnam

TIA2101GF 2K Thermally Conductive Gap Filler

  • Product code: TIA2101GF
  • Manufacturer: Momentive
  • Package size: 333 ml
  • Shelf Life:

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Momentive’s thermally conductive gap fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path. These non-adhesive curing type TIMs form a soft, stress-absorbing thermal interface. In addition to filling gaps in electronic components, they are also applied to flat or high-profile 3-dimensional surfaces as a cured-in-place thermal pad or as a pump-out resistant alternative to greases.

FEATURES:

  • High thermal conductivity (10.1 W/m.K)
  • Dispensable formulation that conforms to complex shapes.
  • Soft, stress-absorbing
  • Electrically insulative
  • Repairable
  • Ability to remain in place under thermal cycling scenarios
    ✓ No-sag
    ✓ No crack
    ✓ No voiding
PropertiesTIA2101GF
Type2 Part Curing Ge
ColorPale Pink
Viscosity (23oC) Pa.s (Part A)820
Viscosity (23oC) Pa.s (Part A)830
Pot Life h1
Cure Time (@70C) min60
Thermal Conductivity W/m.K10.1
Thermal Resistance2 (BLT) mm².K/W22
Volume Resistivity MΩ.m3.0×10^13
Volatile Siloxane (D4-D10) ppm<100

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    TIA2101GF 2K Thermally Conductive Gap Filler

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      TIA2101GF 2K Thermally Conductive Gap Filler

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        TIA2101GF 2K Thermally Conductive Gap Filler

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          TIA2101GF 2K Thermally Conductive Gap Filler

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