This is a highly viscous, solvent-free reactive silicone system thermal paste developed by Everwide Chemical Co. for advanced electronic applications.
Engineered not to undergo a hardening reaction when combined with parts, this advanced resin allows for easy stripping and reworking of electronic assemblies.
It offers an impressive combination of both excellent electrical insulation and superior thermal conductivity, maintaining its properties consistently without drying out over extended periods.
Ideal for a wide array of sophisticated electronic devices, including flip chips, BGAs, diodes, power switches, transistors, and silicone-controlled rectifiers.
Key Features
Contains no conductive metals, ensuring both high electrical insulation and outstanding thermal conductivity.
Optimized for applications where the gap between components is less than 1mm.
Easily cleaned using common isopropyl alcohol for convenient maintenance.
Boasts a broad operating temperature range, effectively functioning from -40 °C to 180 °C.
Suitable for efficient application through both commercial dispensing equipment and steel plate printing methods.
Complies with the stringent 2011/65/EU RoHS regulations, ensuring environmental responsibility.
Exhibits excellent rheological properties, demonstrating no sag at high temperatures and featuring minimal exudation.
Meets the requirements of the UL 94V-0 flammability standard for enhanced safety.
