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Thermally Conductive Vapour Chamber TGVC-106-70-3.0-01

  • Product code: TGVC-106-70-3.0-01
  • Manufacturer: t-Global
  • Package size: L: 106mm / W: 70mm / T: 3.0mm
  • Shelf Life:

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Vapour chambers are an innovative passive thermal management component used in applications with very high heat densities. Using the physical effect of phase change between liquid and gas, these devices provide extremely low thermal resistances in both the XY and Z planes. Vapour chambers offer superior thermal performance as heat spreaders over metal and ceramic alternatives and are also lighter and thinner.

FEATURES:

  • Excellent XY conduction (heat spreading)
  • Passive component with high stability (reliable)
  • Very low thermal resistance

APPLICATIONS:

  • Best for high power applications
  • Electronic components: IC, CPU, MOS, LED, Motherboard,
  • Power Supply, Heat Sink,
  • LCD TV, Notebook, PC, Telecom Device, Wireless Hub, etc.
  • DDR II Module, DVD Applications, Hand-set applications, etc.
Property Value Unit
Type of Product Vapour Chamber –
Thermal Resistance ≤ 0.160 °C/W
Operation Power ≥150 W
Dimensions L: 106mm / W: 70mm / T: 3.0mm mm

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