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Home > Products > By Application > Adhesives > Epoxy Adhesive > One-part Epoxy > TGKXTW Thermal Conductive Epoxy
TGKXTW Thermal Conductive Epoxy Prostech Vietnam

TGKXTW Thermal Conductive Epoxy

  • Product code: TGKXTW
  • Manufacturer: t-Global
  • Package size: 30ml/300ml/1kg
  • Shelf Life: 6 months

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  • Description
  • Specification
  • TDS/MSDS
  • Related Article

TGKXTW is a one-part, high performance thermal conductive adhesive based on epoxy resins. It cures rapidly at elevated temperatures and has excellent adhesion to most PC boards and electronic components. It may be cured at 100°C or faster at 150°C. and show no sagging. It has a stable pot life and long shelf life even at room temperature of 25°C. It has relatively low viscosity for quicker dispensing from syringes.

FEATURES

  • Single component epoxy
  • 6 month shelf life at -20°C
  • Low viscosity for quicker dispensing from syringes

APPLICATIONS

  • Heat dissipation from electronic components
Property TGKXTWUnitTest Method
AppearanceWhite paste–Visual
Mix ratio, w/w One component––
Shelf life, -20°C 6MonthIn House Test Method
Pot life, 25°C 1WeekIn House Test Method  
Viscosity, Brookfield RVT, 25°C 110,000cPASTM D1084-88
Hardness, cured 120°C/1 hr 86-96Shore DASTM D2240-97
Shear strength, cured 120°C/1 hr 182Kg/cmIn House Test Method
Thixotropic Index 1.8-2.8–ASTM D2196-15
Specific gravity, 25°C 1.98–ASTM D891-95
Tensile Strength9,000 -12,500 psi–
Elongation at break0.5-3.0%–
TG, DSC, cured 120°C/1 hr 120-135°C ASTM D3418-03/E1356-03
CTE
-1
-2
4.0-8.0×10-6
1.4-2.5×10-5
m/m/°C–
Boiling water wt gain, cured
120°C/1 hr
<1.0%In House Test Method
Ionic content, Cl <50ppm–
Ionic content, K <50ppm–
Ionic content, Na <180ppm–
Thermal conductivity>1.1W/mKISO/DIS22007
Electrical resistivity >1.1Ωcm–
Filler type Metal oxideMetal oxide––

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    TGKXTW Thermal Conductive Epoxy

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