TGKXTW Thermal Conductive Epoxy

TGKXTW is a one-part, high performance thermal conductive adhesive based on epoxy resins. It cures rapidly at elevated temperatures and has excellent adhesion to most PC boards and electronic components. It may be cured at 100°C or faster at 150°C. and show no sagging. It has a stable pot life and long shelf life even at room temperature of 25°C. It has relatively low viscosity for quicker dispensing from syringes.

FEATURES

Single component epoxy
6 month shelf life at -20°C
Low viscosity for quicker dispensing from syringes

APPLICATIONS

Heat dissipation from electronic components

Property	TGKXTW	Unit	Test Method
Appearance	White paste	–	Visual
Mix ratio, w/w	One component	–	–
Shelf life, -20°C	6	Month	In House Test Method
Pot life, 25°C	1	Week	In House Test Method
Viscosity, Brookfield RVT, 25°C	110,000	cP	ASTM D1084-88
Hardness, cured 120°C/1 hr	86-96	Shore D	ASTM D2240-97
Shear strength, cured 120°C/1 hr	182	Kg/cm	In House Test Method
Thixotropic Index	1.8-2.8	–	ASTM D2196-15
Specific gravity, 25°C	1.98	–	ASTM D891-95
Tensile Strength	9,000 -12,500	psi	–
Elongation at break	0.5-3.0	%	–
TG, DSC, cured 120°C/1 hr	120-135	°C	ASTM D3418-03/E1356-03
CTE -1 -2	4.0-8.0×10^-6 1.4-2.5×10^-5	m/m/°C	–
Boiling water wt gain, cured 120°C/1 hr	<1.0	%	In House Test Method
Ionic content, Cl	<50	ppm	–
Ionic content, K	<50	ppm	–
Ionic content, Na	<180	ppm	–
Thermal conductivity	>1.1	W/mK	ISO/DIS22007
Electrical resistivity	>1.1	Ωcm	–
Filler type Metal oxide	Metal oxide	–	–

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