Soder-Wick No Clean Desoldering Braid SW16055

Product code: SW16055
Manufacturer: Chemtronics
Package size: #5 brown, 0.145"/3.7mm width 5' / 1.5 m length on SD bobbin 10 bobbins per VacuPak™ Can
Shelf Life: 2 years

Soder-Wick No Clean SW16055 is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.

FEATURES:

Requires little or no post solder cleaning
No corrosive residues
Halide free
ESD Safe bobbins meet specs:
MIL-STD-1686C
MIL-HDBK-263B
Static decay provision of
MIL-B-81705C
Minimal risk of heat and static component damage

TYPICAL APPLICATIONS: Soder-Wick No Clean SW16055 safely removes solder from:

Lugs and Posts
Micro Circuits
Surface Mount Device Pads
Ball Grid Array Pads

Surface Insulation Resistance

Bellcore TR-NWT-000078: PASS
After 96 Hours (megohms) 2 x 104 Limit
Group A Group B Group C
4.8 x 10∧6 3.8 x 10∧6 4.1 x 10∧6

ANSI/IPC J SF-818 : PASS
After 168 Hours (ohms) 1.8 x 108 Limit
1-2 2-3 3-4 4-5
2.3 x 10∧10 2.6 x 10∧10 2.8 x 10∧10 2.8 x 10∧10

Electromigration : PASS
Average Insulation Resistance
(megohms)-One Decade Limit
Initial Final
Group E 3.93 x 10∧3 1.24 x 10∧4
Group F 3.87 x 10∧3 2.84 x 10∧4
At 10x magnification no evidence of electromigration or heavy corrosion.

Silver Chromate Test Paper: PASS

Copper Mirror Test: PASS

Shelflife: 2 years