Soder-Wick No Clean Desoldering Braid SW16055

Soder-Wick No Clean SW16055 is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.

FEATURES:

•  Requires little or no post solder cleaning
•  No corrosive residues
•  Halide free
•  ESD Safe bobbins meet specs:
                   MIL-STD-1686C
                   MIL-HDBK-263B
                   Static decay provision of
                   MIL-B-81705C
•  Minimal risk of heat and static component damage

TYPICAL APPLICATIONS: Soder-Wick No Clean SW16055 safely removes solder from:

•  Lugs and Posts
•  Micro Circuits
•  Surface Mount Device Pads
•  Ball Grid Array Pads