SILCOOL™ TIA221GF is a two-component, thermally conductive silicone material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency offers physical stability to prevent run-off after dispensing. SILCOOL™ TIA221GF can typically be used as a liquid dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.
KEY FEATURES of SILCOOL™ TIA221GF
- Low density
- Good thermal conductivity
- Easy to use 1:1 mixing ratio
- Fast, room temperature cure and good thixotropic properties
- Flame retardant: UL94 V-0 equivalent
APPLICATIONS of SILCOOL™ TIA221GF
Thermal interface material designed for electronic components of consumer applications
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
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| Uncured Properties (23℃) | TIA221GF(A) | TIA221GF(B) |
| Appearance | Light Grey | Dark Grey |
| Viscosity Pa∙s | 270 | 270 |
| Thixotropic Index, 1s^-1/10s^-1 | 4.3 | |
| Mix ratio by weight | 100:100 | |
| Viscosity after mixing Pa∙s | 270 | |
| Pot Life hr. | 1 | |
| Cure condition (70℃) hr. | 1 | |
| Cure condition (23℃) hr. | 24 | |
| Cured Properties (1hr at 70℃) | ||
| Appearance | Grey | |
| Density g/cm³ | 1.95 | |
| Thermal conductivity W/m∙K | 2.2 | |
| Shore E | 50 | |
| Tensile Strength MPa | 0.25 | |
| Elongation % | 40 | |
| Volume resistivity MΩ∙m | ≥1×10^6 (estimated) | |
| Dielectric strength kV/mm | ≥15 (estimated) | |
