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Home > Products > By Market > Electronics > SILCOOL™ TIA221GF LIQUID-DISPENSED SILICONE THERMAL PAD / GAP FILLER
SILCOOL™ TIA221GF LIQUID-DISPENSED SILICONE THERMAL PAD / GAP FILLER Prostech Vietnam

SILCOOL™ TIA221GF LIQUID-DISPENSED SILICONE THERMAL PAD / GAP FILLER

SILCOOL™ TIA221GF is a 2-component, soft, thermally conductive material

  • Product code: TIA221GF
  • Manufacturer: Momentive
  • Package size: 20L Drum
  • Shelf Life: Contact us for more details
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  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • KEY FEATURES of SILCOOL™ TIA221GF 
  • APPLICATIONS of SILCOOL™ TIA221GF 
  • About Prostech

SILCOOL™ TIA221GF is a two-component, thermally conductive silicone material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency offers physical stability to prevent run-off after dispensing. SILCOOL™ TIA221GF can typically be used as a liquid dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.

KEY FEATURES of SILCOOL™ TIA221GF 

  • Low density
  • Good thermal conductivity
  • Easy to use 1:1 mixing ratio
  • Fast, room temperature cure and good thixotropic properties
  • Flame retardant: UL94 V-0 equivalent

APPLICATIONS of SILCOOL™ TIA221GF 

Thermal interface material designed for electronic components of consumer applications

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

Uncured Properties (23℃)TIA221GF(A)TIA221GF(B)
AppearanceLight GreyDark Grey
Viscosity Pa∙s270270
Thixotropic Index, 1s^-1/10s^-14.3
Mix ratio by weight100:100
Viscosity after mixing Pa∙s270
Pot Life hr.1
Cure condition (70℃) hr.1
Cure condition (23℃) hr.24
Cured Properties (1hr at 70℃)
AppearanceGrey
Density g/cm³1.95
Thermal conductivity W/m∙K2.2
Shore E50
Tensile Strength MPa0.25
Elongation %40
Volume resistivity MΩ∙m≥1×10^6 (estimated)
Dielectric strength kV/mm≥15 (estimated)

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    SILCOOL™ TIA221GF LIQUID-DISPENSED SILICONE THERMAL PAD / GAP FILLER

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      SILCOOL™ TIA221GF LIQUID-DISPENSED SILICONE THERMAL PAD / GAP FILLER

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        SILCOOL™ TIA221GF LIQUID-DISPENSED SILICONE THERMAL PAD / GAP FILLER

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          SILCOOL™ TIA221GF LIQUID-DISPENSED SILICONE THERMAL PAD / GAP FILLER

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