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Home > Products > By Manufacturer > RedRing Solder > NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste

NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste

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NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste:

  • Halide content <0.005% per IPC-TM-650, method 2.3.35
  • Superior wetting and through-hole fill in the lead-free system
  • Good cohesion during reflow which minimizes micro-solderballing defect 
  • Handles fine pitch of 4.0mm and suit high speed printing up to 150mm/s
  • Passed SIR & Electromigration as the Bellcore GR-78-core
  • Improvement on long tackiness time and stable viscosity with new flux technology 

*according to International Electrochemical Commission and IPC definition

Type of flux フラックスタイプ No clean, non halide
ROLO (J-STD-004)
Halide content ハロゲン含有量 <0.05%
JIS Z 3197, IPC-TM-650
Flux content (wt%) フラックス含有量 (%) 10.5 – 12.0 JIS Z 3284
Spread factor (%) はんだ広がり率 (%) >85%
JIS Z 3284, IPC-TM-650
Viscosity@25°C (Pa.s) 粘度 160-220
JIS Z 3284, IPC-TM-650
Tackiness 粘着性 64 hours
JIS Z 3184, IPC-TM-650
Thixotropy index チクソトロピー指数 0.5 – 0.6 Standard
Powder size (µm) 粉末サイズ 25-45 , 20-38  
Alloy available 適用可能合金
G220, G217, G237 & G225
 

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    NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste

      Leave your information via Form, our Technical Support Team will contact you shortly!

      NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste

        Leave your information via Form, our Technical Support Team will contact you shortly!

        NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste

          Leave your information via Form, our Technical Support Team will contact you shortly!

          NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste

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