- Halide content <0.005% per IPC-TM-650, method 2.3.35
- Superior wetting and through-hole fill in the lead-free system
- Good cohesion during reflow which minimizes micro-solderballing defect
- Handles fine pitch of 4.0mm and suit high speed printing up to 150mm/s
- Passed SIR & Electromigration as the Bellcore GR-78-core
- Improvement on long tackiness time and stable viscosity with new flux technology
NEW FLUX SERIES “XF-07-03 New generation of Halogen-Free* solder paste
- Product code:
- Manufacturer: RedRing Solder
- Package size:
- Shelf Life: