XE11-B5320 is a one-component paste, alkoxy cure, thermally conductive silicone adhesive sealant. This product cures at room temperature by reacting with moisture in the air to form an elastomeric rubber. XE11-B5320 silicone adhesive typically offers primerless adhesion to many substrates such as most metals, plastics, ceramics, and glass without the use of a primer.
XE11-B5320 silicone adhesive is non-corrosive to metals and may be suitable for electrical/electronic applications. Typical applications for XE11-B5320 silicone adhesive include sealing and bonding for thermally conductive applications such as heat generating elements, regulators and rectifiers.
- Excellent thermal conductivity
- Low volatility; reduced low-molecular siloxane content
- One-component; ready to use
- Room temperature cure
- Neutral cure; non-corrosive to metals
- Low odor cure; releases an alcohol vapor during cure
- Excellent adhesion to most substrates
|Tack Free Time (23°C) min||5|
Cured Properties (7 days @ 23°C/50%RH).
|Appearance||White, elastic rubber|
|Specific Gravity (23°C)||2.59|
|Hardness (Type A)||83|
|Tensile Strength MPa [psi]||4.1 |
|Adhesive Strength(1) MPa [psi]||1.4 |
|Thermal Conductivity W/mK [cal/(s•cm•°C)]||1.3 [3.1 x 10^-3]|
|Low Molecular Siloxane (D4~D10) wt %||0.01|
|Volume Resistivity MO•m [O•cm]||2.0 x 10^-7 [2.0 x 10^-15]|
|Dielectric Strength kV/mm (V/mil)||17 |