• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Industrial Equipment/ Robots
      • Added-value Services
      • Adhesives
      • Temporary Masking
      • Curing System
      • Converting Services
      • Tapes
      • Abrasives
      • Dispensing System
      • Material Formulation Customization
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Tape Converter Machine
      • Package Customization
      • Thermal Management
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Conformal Coatings
      • Elastomeric Materials
      • Metrology Equipment
      • Hidden
      • Potting – Encapsulant
      • Immersion Cooling Fluids
      • Plasma Treatment
      • Hidden
      • Low Pressure Molding
      • Lubricant
      • Labelling Printer
      • Hidden
      • Electronic Glob-top
      • Impregnating resin
      • Robotic & Automation
      • Hidden
      • Electronic Dam & Fill
      • Insulation
      • Hidden
      • Hidden
      • Electronic Staking/Fixing
      • Thinner Liquid
      • Hidden
      • Hidden
      • Electronic Underfill
      • Labelling Printing
      • Hidden
      • Hidden
      • EMI Shielding
      • Industrial Coating
      • Hidden
      • Hidden
      • Cleaner Degreaser
      • Maintain and Repair
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Other Industrial Materials
      • Hidden
      • Hidden
      • Primer and Adhesion Promoter
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • tesa
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Industrial Equipment/ Robots
      • Added-value Services
      • Adhesives
      • Temporary Masking
      • Curing System
      • Converting Services
      • Tapes
      • Abrasives
      • Dispensing System
      • Material Formulation Customization
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Tape Converter Machine
      • Package Customization
      • Thermal Management
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Conformal Coatings
      • Elastomeric Materials
      • Metrology Equipment
      • Hidden
      • Potting – Encapsulant
      • Immersion Cooling Fluids
      • Plasma Treatment
      • Hidden
      • Low Pressure Molding
      • Lubricant
      • Labelling Printer
      • Hidden
      • Electronic Glob-top
      • Impregnating resin
      • Robotic & Automation
      • Hidden
      • Electronic Dam & Fill
      • Insulation
      • Hidden
      • Hidden
      • Electronic Staking/Fixing
      • Thinner Liquid
      • Hidden
      • Hidden
      • Electronic Underfill
      • Labelling Printing
      • Hidden
      • Hidden
      • EMI Shielding
      • Industrial Coating
      • Hidden
      • Hidden
      • Cleaner Degreaser
      • Maintain and Repair
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Other Industrial Materials
      • Hidden
      • Hidden
      • Primer and Adhesion Promoter
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • tesa
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternative
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Market > Electronics > LOCTITE 3609

LOCTITE 3609

  • Product code: LOCTITE 3609
  • Manufacturer: Henkel
  • Package size: 30 ml
  • Shelf Life:

Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

LOCTITE 3609 is designed for the bonding of surface mounteddevices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. LOCTITE 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.

Technology Epoxy
Chemical Type Epoxy  
Appearance (uncured) Dark, red viscous gel
Components One component – requires no mixing
Cure Heat cure
Application Surface mount adhesive
Key Substrates SMD components to PCB
Other Application Areas Small parts bonding
Dispense Method Syringe
Dispense Speed Medium 15,000 -25,000 dots/h

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Outstanding Feature Product Group

    • red glue

    Similar Products

    • Red Glue/ Chip Bonder One Component Epoxy Everwide JC711-6

      See details
    LOCTITE 3609

      Leave your information via Form, our Technical Support Team will contact you shortly!

      LOCTITE 3609

        Leave your information via Form, our Technical Support Team will contact you shortly!

        LOCTITE 3609

          Leave your information via Form, our Technical Support Team will contact you shortly!

          LOCTITE 3609

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!