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LOCTITE 3609
Product code: LOCTITE 3609
Manufacturer: Henkel
Package size: 30 ml
Shelf Life:
LOCTITE 3609 is designed for the bonding of surface mounteddevices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. LOCTITE 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
| Technology | Epoxy |
| Chemical Type | Epoxy |
| Appearance (uncured) | Dark, red viscous gel |
| Components | One component – requires no mixing |
| Cure | Heat cure |
| Application | Surface mount adhesive |
| Key Substrates | SMD components to PCB |
| Other Application Areas | Small parts bonding |
| Dispense Method | Syringe |
| Dispense Speed | Medium 15,000 -25,000 dots/h |
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