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Liquid-Dispensed Silicone Thermal Pad / Gap Filler SilCool TIA241GF

  • Product code: TIA241GF
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  • Shelf Life:

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SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping pasty consistency offers physical stability that can allow improved processing. SilCool TIA241GF gap filler can be used as a liquid dispensed alternative to pre-fabricated thermal pads in a broad array of thermal designs for electronic applications.

Key Features

  • Good thermal conductivity
  • Fast, low temperature cure
  • Convenient 1:1 mix ratio by weight
  • Retained softness after cure for enhanced stress relief during thermal cycling
  • Excellent slump resistance (stays in place)
  • Repairable
  • Flame retardant: UL94V-0 equivalent
  • Glass bead options available (180 & 250μm) for bond line thickness (BLT) control

Applications 

Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.

Đặc điểmSilCool TIA241GF (A)SilCool TIA241 GF (B) 
Màu (thành phần A & thành phần B)xanhxanh nhạt
Độ nhớt *1 Pa•s250130
Tỷ lệ trộn theo trọng lượng1:11:1
Độ nhớt sau khi trộn Pa•s130130
Chỉ số lưu biến  2.62.6
 Thời gian thao tác ở 23°C (giờ)33
Điều kiện khô (giờ) 
at 100 °C
at 70 °C
at 23 °C		0.25
0.50
24		0.25
0.50
24

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