LiPOLY T-top91-s High Thermal Conductive Gap Filler offers outstanding thermal conductivity at 13.0 W/m*K and extremely low thermal resistance under minimal force. T-top81-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
FEATURE of LiPOLY T-top91-s High Thermal Conductive Gap Filler
- Thermal conductivity: 13.0 W/m*K
- High compression rate
- Extremely low thermal impedance
APPLICATION of LiPOLY T-top91-s High Thermal Conductive Gap Filler
- Between CPU and heat sink
- Between a component and heat sink
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- EV electric vehicle
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
PROPERTY | T-top91-s | TEST METHOD | UNIT |
Color | Gray Green | Visual | – |
Surface tack 2-side/1-side | 2 | – | – |
Thickness | Customized | ASTM D374 | mm |
Density | 3.4 | ASTM D792 | g/cm³ |
Hardness | 65 | ASTM D2240 | Shore OOO |
TML | <0.1 | By LiPOLY | % |
Application temperature | -60~150 | – | °C |
ROHS & REACH | Compliant | – | – |
COMPRESSION | |||
Deflection @10 psi | 11 | ASTM D5470 modify | % |
Deflection @20 psi | 38 | ASTM D5470 modify | % |
Deflection @30 psi | 59 | ASTM D5470 modify | % |
Deflection @40 psi | 69 | ASTM D5470 modify | % |
Deflection @50 psi | 76 | ASTM D5470 modify | % |
ELECTRICAL | |||
Dielectric breakdown | 8 | ASTM D149 | KV/mm |
Surface resistivity | >10¹¹ | ASTM D257 | Ohm |
Volume resistivity | >10¹⁰ | ASTM D257 | Ohm-m |
Dielectric constant@10MHz Dk | 9.9 | ASTM D150 | – |
Dielectric constant@1GHz Dk | 9.8 | ASTM D150 | – |
Dielectric constant@1.8GHz Dk | 11.4 | ASTM D150 | – |
Dielectric factor@10MHz Df | 0.007 | ASTM D150 | – |
Dielectric factor@1GHz Df | 0.004 | ASTM D150 | – |
Dielectric factor@1.8GHz Df | 0.024 | ASTM D150 | – |
THERMAL | |||
Thermal conductivity | 13.0 | ASTM D5470 | W/m*K |
Thermal Conductivity | 8.0 | ISO 22007-2 | W/m*K |
Thermal impedance@10psi | 0.201 | ASTM D5470 | °C-in²/ W |
Thermal impedance@20psi | 0.159 | ASTM D5470 | °C-in²/ W |
Thermal impedance@30psi | 0.103 | ASTM D5470 | °C-in²/ W |
Thermal impedance@40psi | 0.084 | ASTM D5470 | °C-in²/ W |
Thermal impedance@50psi | 0.075 | ASTM D5470 | °C-in²/ W |
Coefficient of thermal expansion | -179.04×10ˉ⁶ | ASTM E228 | 1/K |
