JONES Thermal PAD 21-250-300-0816

JONES Thermal Pad 21-250 is designed to provide excellent performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression. JONES Thermal Pad 21-250 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.

FEATURE

Thermal Conductivity: 5.0W/m·K
Extremely Good Thermal Performance
Very Good Compressibility
High Breakdown Voltage
Easy For Installation

APPLICATION

Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
Power Electronics

Properties		Thermal Pad 21-250	Test Method
Thermal	Thermal Conductivity (W/m·K)	5.0	ASTM D5470
Thermal	Operating Temperature Range (°C)	-55~200	JONES Test Method
Physical	Color	Grey	Visual
	Composition	Ceramic&Silicone	–
	Density (g/cm^3)	2.8	ASTM D792
	Thickness Range (mm)	0.5~5.0	ASTM D374
	Thickness Tolerance(mm)> 1mm	±10%	–
	Thickness Tolerance(mm)</= 1mm	±0.1	–
	Hardness (Shore 00)	50	ASTM D2240
Electrical	Breakdown Voltage (KV AC/mm)	>5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^14	ASTM D257
	Dielectric Constant@1MHz	4.6	ASTM D150
Regulatory	Flame Rating	V0	UL 94

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