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JONES Thermal Pad 21-233 Prostech Vietnam

JONES Thermal Pad 21-233

  • Product code: 21-233
  • Manufacturer: Jones Tech
  • Package size: 16” X 8” (406mmX203mm)
  • Shelf Life: 24 months

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Through innovative technology, this soft and conformable thermal pad is designed to provide high level of thermal performance with minimum pressure on electronic components.

FEATURE

  • Very Good Thermal Performance
  • Good Compression and Elasticity Compression Deflection
  • Tiny Outgassing
  • Designed For Smartphone Industry
  • Easy For Installation
  • RoHS Compliant

APPLICATION

  • Memory Modules
  • Mass Storage Devices
  • Automotive Electronics
  • Telecommunication Hardware
  • Radios
  • Power Electronics
  • Set-Top Boxes
  • Audio And Video Players
  • IT Infrastructure

Properties

 

 

Thermal Pad 21-233

Test Method

Thermal

 

Thermal Conductivity (W/m-K)

 

    Continuous Use Temp. (°C)                                 

3

 

                 -55~200                        

ASTM D5470

 

             TGA                 

Physical

Color

Substrate

Density (g/cm^3)

Thickness Range (mm)

Thickness Tolerance

     > 1mm

</= 1mm

Hardness (Shore 00)

Outgassing, %TML

Outgassing, %CVCM

Grey

Silicone

2.50

0.5~5

 

 ±10%

±0.1mm

40

0.093

0.027

Visual

–

ASTM D792

ASTM D374

–

–

–

ASTM D2240

ASTM E595

ASTM E595

 

Dielectric Breakdown Voltage

(KVAC/mm)

Dielectric Constant@1MHz

Volume Resistivity (ohm-cm)

  >5

 

7.58

>10^13

ASTM D149

 

ASTM D150

ASTM D257

Electrical

 

 

Flame Rating

RoHS

Shelf Life (months)

V0

YES

24

UL 94

–

–

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