JONES Thermal Grease 21-430SF

JONES Thermal Grease 21-430SF is a silicone-free based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.

FEATURE

Thermal Conductivity: 3 W/m·K
Moderate Viscosity
Low Thermal Resistance
High Thermal Conductivity
Silicon-free
Solvent-free

APPLICATION

CPUs (Notebooks, PCs, Servers)
LED Solid State Lighting
GPUs

Properties		Thermal Grease 21-430SF	Test Method
Thermal	Thermal Conductivity (W/m·K)	3.0	ASTM D5470
	Thermal Resistance @40 psi (°C·cm^2/W)	0.153	ASTM D5470
	Operating Temperature Range(°C)	-40~125	JONES Test Method
Physical	Color	Grey	Visual
	Composition	Ceramic&Silicone-free	–
	Typical Minimum Bondline Thickness (μm)	25	JONES Test Method
	Viscosity @20rpm (Pa·s)	150	ASTM D2196
	Density (g/cm³)	2.3	ASTM D792
Electrical	Breakdown Voltage (KV AC /mm)	>12	ASTM D149
	Volume Resistivity (Ohm·cm)	10^12	ASTM D257
	Dielectric Constant @1MHz	4.8	ASTM D150
Regulatory	Flame Rating	V0	UL 94

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