JONES Thermal Gel 21-340-SP01

JONES Thermal Gel 21-340-SP01 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances presently and low mechanical stress on delicate components . It is ideal for filling variable gaps between multiple components and a common heat sink. JONES Thermal Gel 21-340-SP01 has superior thermal performance and super compliancy. It provides outstanding reliability. Specialized rheology allows for easy flow under pressure.

FEATURE

Thermal Conductivity: 3.5 W/m-K
Soft and Compliant Transferring Little
To No Pressure Between Interfaces
Easily Dispensable
Pre-Cured
Electrically Isolating
Low Thermal Resistance

APPLICATION

Cooling components to chassis, frame, or other mating components
Memory modules
Mass storage devices
Automotive electronics
Telecommunication hardware
Power electronics
LCD and PDP flat panel
Audio and video component
IT infrastructure
GPS navigation and other portable devices

Properties		Thermal Gel 21-340-SP01	Test Method
Thermal	Thermal Conductivity (W/m·K)	3.5	ASTM D5470
	Thermal Resistance (°C.cm^2/W) @1mm	–	ASTM D5470
	Operating Temperature Range (°C)	-55~150	JONES Test Method
Physical	Color	Green	Visual
	Composition	Ceramic & Silicone	–
	Density (g/cc)	3.2	ASTM D792
	Flow Rate (g/min)	48	90 Psi,EFD 180cc @ Ø3.17mm nozzle
	Typical Minimum Bondline Thickness (mm)	0.10	JONES Test Method
Electrical	Breakdown Voltage (KV AC /mm)	> 5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^13	ASTM D257
	Dielectric Constant @1MHz	5.0	ASTM D150
Regulatory	Flammability Rating	V0	UL 94

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