JONES TECH Thermal Gel 21-335

Product code: 21-335
Manufacturer: Jones Tech
Package size:
Shelf Life:

21-335 Series is Two-Part Thermal Gel with low viscosity, silicone putty thermal gap filler in which is cured in room temperature. It is designed to be used where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink.

Key Features

Extreme Low stress induced during assembly
Easy for rework
Easily dispensable
Cured in room Temperature
Electrically Isolating
Low Thermal Resistance

Applications

Smart device/phone
Cooling components to chassis, frame, or other mating components
Memory modules
Home & Small Office Network
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
LED Solid State Lighting
Power Electronics
Set Top Boxes
Audio & Video Component
IT infrastructure
GPS navigation and other portable
devices

Property	Value
Thermal Conductivity (W/m-K)	3.2
Thermal Resistance (°C.cm^2/W)@ 1mm	3.05
Color/ Part A	Green
Color/ Part B	Light grey
Before Cure	520,000
Viscosity as mixed (mPa-s)	500,000
Mix Ratio	1:1
(Cured) Color	Green
Tensile lap-shear strength (psi)	18
Density (g/cc)	3.0
Hardness (Shore OO)	50
Breakdown Voltage(kV/mm)	>6
Volume Resistivity (ohm-cm)	>10^12
Dielectric Constant @10MHz	4.9
Operation Temperature Range(°C)	-40~150
Pot Life @ 25 °C (min)	120
Cure @ 25 °C (hrs)	18
Cure @ 100 °C (min)	20